After overviewing the materials and processing of lead-free soldering, this collection presents the latest research on the microstructure of lead-free solder joints, the creep and fatigue properties of solder alloys, and the reliability difference between tin-lead and lead-free solders. The 12 contributions also examine accelerated testing methodologies, thermomechanical reliability prediction, finite element modeling for reliability design, and the failure analysis issues that arise as a result of replacing lead in electronic solders. The data focuses primary on tin-silver-copper and tin-copper alloys as these are the primary lead-free solder alloys currently being developed for the electronics industry. Annotation © 2006 Book News, Inc., Portland, OR